Winbond Semiconductor Facility
Taiwan
About
This Work
A new greenfield 300mm semiconductor fabrication facility supported by a fully equipped central utility building. MEC provided electrical engineering for the site’s high-voltage 161 kV substation and oversaw the design of the 12.47 kV electrical distribution necessary to support advanced 300mm wafer processing. The project required highly stable power infrastructure, tight coordination with process systems, and industrial-scale capacity planning.
Project Specifications
Facility Type:
300mm semiconductor fabrication plant
Facility Infrastructure:
Central Utility Building with mechanical, electrical, and process utilities
Power Systems:
161 kV primary substation design
12.47 kV medium-voltage distribution
Redundant and looped distribution for fab reliability
Capacity planning for high-density tool loads
Specialized Systems Supported:
Semiconductor process tool power
Cleanroom systems integration
Precision environmental control loads
High-availability power distribution for 24/7 operation
Powering Your Vision
From the first spark of an idea to a fully energized project, MEC is here to make your electrical solutionssmarter, safer, and stronger. Let’s bring it to life.
